Intel Showcases Intelligent Edge and Energy Efficient Performance Research at 2020 VLSI Symposium

intel.jpg” alt=”intel.jpg”/>

At this week’s 2020 VLSI Technology and Circuits Symposium, Intel will present a series of research findings and technical perspectives on the computing transformation caused by the growing amount of data distributed across the core, edge and endpoint. CTO Mike Mayberry will deliver a keynote speech titled “The Future of Computing: How Data Transformation is Reshaping VLSI,” highlighting the importance of transitioning from hardware/program-centric computing to data/information-centric computing.

“The massive flow of data across distributed edge, network, and cloud infrastructure requires energy-efficient and robust processing close to where the data is generated, often constrained by bandwidth, memory, and power resources .Intel Research at the VLSI Symposium highlighted several new ways to improve computational efficiency that show promise in a variety of application areas, including robotics, augmented reality, machine vision, and video analytics. The focus is on addressing the barriers to data movement and computing that represent the biggest data challenges of the future.”

– Vivek K. De, Intel Fellow, Director of Circuit Technology Research, Intel Research

  what will be shown: Some Intel research papers will be presented in this symposium on how higher levels of intelligence and higher energy efficiency can be achieved in future edge-network-cloud systems to support a growing number of edge applications. Some of the topics covered in the research paper (full list of studies at the end of this press release) include:

  Using ray casting hardware accelerators to improve the efficiency and accuracy of 3D scene reconstruction for edge robots

  paper: Efficient 3D scene reconstruction via a ray-casting accelerator in 10 nm CMOS in edge robotics and augmented reality applications

  important meaning: Certain applications, including edge robotics and augmented reality, require accurate, fast, and energy-efficient reconstruction of complex 3D scenes from large amounts of data generated by raycasting operations for dense simultaneous localization and mapping in real-time ( SLAM). In this research paper, Intel highlights a new ray-casting hardware accelerator that leverages new technologies to maintain scene reconstruction accuracy while achieving exceptionally energy-efficient performance. These innovative approaches include techniques such as voxel overlap search and hardware-assisted approximate voxel computation, which reduce the need for local memory, and also improve power efficiency for future edge robotics and augmented reality applications.

 Utilize event-driven visual data processing units (EPUs) to reduce power consumption for deep learning-based video streaming analysis

paper: A 0.05pJ/pixel 70fps FHD 1Meps event-driven visual data processing unit

  important meaning: Visual data analysis based on real-time deep learning is mainly used in fields such as safety and security, requiring fast detection of objects in multiple video streams, thus requiring long computing time and high memory bandwidth. The input frames from these cameras are often downsampled to minimize the load, which reduces image accuracy. In this study, Intel demonstrated an event-driven visual data processing unit (EPU) that, when combined with novel algorithms, can instruct deep learning accelerators to process visual input using only motion-based “target regions.” This novel approach alleviates the computationally intensive and high memory requirements in edge vision analysis.

  Extend local memory bandwidth to meet the demands of AI, machine learning and deep learning applications

paper: 2x bandwidth burst 6T-SRAM designed for memory bandwidth limited workloads

Why it matters: Many AI chips, especially those used for natural language processing (such as voice assistants), are increasingly constrained by local memory. Addressing memory challenges requires providing frequency multipliers or increasing the number of memory slots at the cost of lower power consumption and area efficiency, especially for area-constrained edge devices. Through this study, Intel demonstrated how to use a 6T-SRAM array to provide 2x the read bandwidth on demand in burst mode, with 51% higher energy efficiency than frequency doubling and area efficiency over doubling the number of memory sockets 30%.

  All-Digital Binary Neural Network Accelerator

paper: 617TOPS/W all-digital binary neural network accelerator with 10nm FinFET CMOS

  important meaning: In power- and resource-constrained edge devices, low-precision outputs are acceptable for some applications, and analog Binary Neural Networks (BNNs) can be used as an alternative to higher-precision neural networks. The latter are more computationally demanding and have intensive memory requirements. However, the prediction accuracy of analog BNNs is lower because they are less tolerant to process variation and noise. Through this study, Intel demonstrates the use of an all-digital BNN that has energy efficiency similar to analog input memory technology, while providing better robustness and scalability for advanced process nodes.

Other Intel research presented at the 2020 VLSI Symposium includes the following papers:

The future of computing: How data transformation is reshaping VLSI

Low clock power digital standard cell IP for high performance graphics/AI processors in 10nm CMOS

An autonomously reconfigurable power delivery network (RPDN) for multicore SoCs with dynamic current control

3D monolithic heterogeneous integration enables GaN and Si transistors on 300mm silicon wafers (111)

Low-swing and column-multiplexed bit-line technology for low-Vmin, noise-tolerant, high-density 1R1W 8T-bit cell SRAM in 10nm FinFET CMOS

A dual-rail hybrid analog/digital LDO with dynamic current control for tunable high PSRR and high efficiency

A 435MHz, 600Kops/J side-channel attack-resistant encryption processor for secure RSA-4K public key encryption in 14nm CMOS

A 0.26% BER 10^28 modeling challenge-response PUF in 14nm CMOS with Stability-Aware Adversarial Challenge Selection

An anti-SCA AES engine with 6000x time/frequency domain leakage suppression using nonlinear digital low-dropout regulators cascaded with 14nm CMOS computational countermeasures

SOT-MRAM CMOS compatible process integration with heavy metal bilayer bottom electrode and 10ns field-free SOT conversion with STT assistance

Self-folding write-assisted 10nm SRAM design with gate modulation reduces VMIN by 175mV with negligible power overhead

About Intel

Intel (NASDAQ: INTC) is an industry leader creating world-changing technologies that drive global progress and enrich life. Inspired by Moore’s Law, we continue to advance semiconductor design and manufacturing to help our customers meet their most important challenges. By infusing intelligence into the cloud, network, edge and computing devices of all kinds, we unlock the potential of data to make business and society a better place. For more information on Intel innovation, please visit Intel China and the official website

Intel Corporation, Intel, the Intel logo and other Intel logos are trademarks of Intel Corporation or its affiliates. Other names and brands mentioned herein are the property of their respective owners.

If you have any questions, please contact:

Intel (China) Co., Ltd.

Ms Lucy Meng

Tel: 010-57511407


Ogilvy PR

Ms. Zhang Yiyuan

Tel: 010-8520 3371


The Links:   LM64N731 7MBR50UA120-50