Samsung releases three 5G RAN device chip products: commercial in 2022

C114 News, Beijing time, June 23 (Ace) This Tuesday, Samsung Electronics announced the release of three new chip products that support the 3GPP R16 standard for 5G RAN equipment, including its third-generation millimeter-wave RFIC chip, second-generation millimeter-wave RFIC chip Generation 5G modem SoC and a digital front-end (DFE)-RFIC integrated chip. These latest chips will be used in Samsung’s next-generation 5G products, including its next-generation 5G Compact Macro, Massive MIMO radios and baseband units, all of which will be commercially available in 2022.

Samsung releases three 5G RAN device chip products: commercial in 2022

Samsung announced the chips at its recent “Samsung Networks: Redefined” online event. At the event, Samsung highlighted its more than 20 years of experience in chip self-development, and reiterated its significant investment behind the launch of multiple generations of chipsets starting with 3G, leading to the company’s leading 5G solutions today. Program.

Samsung said its new chipset is designed to take Samsung’s next-generation 5G product line to a new level, enabling related products to improve performance, improve energy efficiency, and reduce the size of 5G equipment products.

Specifically, Samsung’s chips include:

Samsung’s third-generation mmWave RFIC:

This chip continues the development of Samsung’s previous generation of RFICs. Launched in 2017, Samsung’s first-generation millimeter-wave RFIC chips are used in the company’s 5G FWA solution, which powers the world’s first 5G home broadband service in the U.S. market. Two years later, Samsung’s second-generation millimeter-wave RFIC chips were used in the company’s 5G Compact Macro product, which has since been widely deployed in the United States.

Samsung’s third-generation millimeter-wave RFIC chip supports both 28GHz and 39GHz frequency bands and will be embedded in Samsung’s next-generation 5G Compact Macro products. The chip uses advanced technology that can reduce the size of the antenna by nearly 50% and maximize the use of the internal space of the 5G base station. In addition, Samsung’s latest RFIC chips have improved power consumption, making 5G base stations more compact and lighter. In addition, the output power and coverage of Samsung’s next-generation RFIC chips have been improved, doubling the output power of its next-generation 5G Compact Macro products.

Samsung’s second-generation 5G modem SoC:

Samsung launched its first 5G modem SoC in 2019, which is used in the company’s 5G baseband unit and 5G Compact Macro products. So far, Samsung’s 5G modem SoC products have shipped more than 200,000 units.

Compared to the previous generation, this new second-generation 5G modem SoC will give Samsung’s upcoming baseband unit twice the capacity while cutting power consumption in half. In addition, Samsung’s second-generation 5G modem SoC supports both Sub-6GHz and mmWave frequency bands, providing beamforming capabilities and higher power efficiency for Samsung’s next-generation 5G Compact Macro products and Massive MIMO RF units, while reducing the size of the two products. The size of the solution.

Samsung DFE-RFIC integrated chip:

In 2019, Samsung launched its first digital/analog front-end (DAFE) chip as an important component of its 5G base station (which includes the Samsung 5G Compact Macro), supporting the 28GHz and 39GHz frequency bands.

Samsung’s new DFE-RFIC integrated chip combines RFIC and DFE functions for Sub-6Hz and mmWave frequency bands. By integrating these functions, the chip not only doubles the frequency bandwidth, but also enables Samsung’s next-generation 5G solutions, including the 5G Compact Macro, to reduce product size and improve output efficiency.

Junehee Lee, Executive Vice President and Head of R&D, Networking Business, Samsung said: “These newly launched chips are the foundational building blocks of our advanced 5G solutions, and through a long-term R&D process, Samsung has been at the forefront of delivering cutting-edge 5G technology. As one of the world’s largest semiconductor companies, we are committed to developing the most innovative chips for the next phase of 5G development and integrating product features that mobile operators seek to remain competitive.”

Anshel Sag, analyst at Moor Insights & Strategy, said: “5G chipsets are critical to enabling the performance capabilities required for next-generation network deployments. Samsung’s long-term experience with in-house chips is a key differentiator, enabling it to become the A leader in delivering 5G solutions that meet operator needs.”

The Links:   G215HVN01.1 FP25R12W2T4